Download 3D Stacked Chips: From Emerging Processes to Heterogeneous by Ibrahim (Abe) M. Elfadel,Gerhard Fettweis PDF

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By Ibrahim (Abe) M. Elfadel,Gerhard Fettweis

This booklet explains for readers how 3D chip stacks promise to extend the extent of on-chip integration, and to layout new heterogeneous semiconductor units that mix chips of alternative integration applied sciences (incl. sensors) in one package deal of the smallest attainable size.  The authors concentrate on heterogeneous 3D integration, addressing probably the most very important demanding situations during this rising expertise, together with contactless, optics-based, and carbon-nanotube-based 3D integration, in addition to signal-integrity and thermal administration matters in copper-based 3D integration. insurance additionally contains the 3D heterogeneous integration of strength resources, photonic units, and non-volatile stories in response to new fabrics systems.

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