Download Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah,Yehea Ismail,Alaa El-Rouby PDF

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By Khaled Salah,Yehea Ismail,Alaa El-Rouby

This publication provides a wide-band and expertise self reliant, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version debts for quite a few results, together with dermis impression, depletion capacitance and close by touch results. Readers will take advantage of in-depth insurance of techniques and know-how resembling 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. options lined are verified by utilizing TSVs in functions corresponding to a spiral inductor and inductive-based verbal exchange method and bandpass filtering.

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