Download Area Array Packaging Handbook: Manufacturing and Assembly by Ken Gilleo PDF

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  • April 11, 2017
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By Ken Gilleo

*Covers layout, packaging, development, meeting, and alertness of all 3 techniques to sector Array Packaging: Ball Grid Array (BGA), Chip Scale package deal (CSP), and turn Chip (FC) *Details the professionals and cons of every expertise with various purposes *Examines packaging ramifications of excessive density interconnects (HDI)

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